immersion gold pcb

Detailed Product Description

2 layer hdi pcb

Minimum Line Width (Internal) 4 mil (0.1 mm) for mass production and 3mil for samples
Minimum Line Width (External): 4 mil (0.1 mm) for mass production and 3 mils for samples.
Minimum Line Spacing (External): 4 mil (0.1 mm) for mass production and 3 mils for samples.
Layer Count & Thickness: 2-12 layers
Minimum Thickness (2 Layers): 4 mil (0.1 mm)
Minimum Thickness (4 Layers): 12 mil (0.3 mm)
Minimum Thickness (6 Layers): 16 mil (0.4 mm)
Minimum Thickness (8 Layers): 24 mil (0.6 mm)
Maximum Thickness(10layers): 200 mil (5.0 mm)
Layer to Layer Registration: +/- 5 mil (0.13 mm)
Via / Drill Size: Minimum Drill Hole Diameter 10 mil (0.25 mm)
Minimum Via Size: 8 mil (0.2 mm)
Hole to Hole Tolerance: +/- 3 mil (0.08 mm)
Hole to Edge Tolerance: +/- 5 mil (0.13 mm)
Micro Via: 4 mil (0.1 mm)
Solder Mask: Solder Mask Bridge Between Solder Dam 3 mil (0.07 mm)
Warpage: 0.5 %
Impedance: +/- 10%